Subsurface damage in grinding of brittle materials considering machining parameters and spindle dynamics

Effect of wire vibration on the materials loss in sapphire slicing with the fixed diamond wire

(2017) Hui Huang et al.   MATERIALS SCIENCE IN SEMICONDUCTOR PROCESSING

Subsurface damage depth and distribution in rotary ultrasonic machining and conventional grinding of glass BK7

(2016) Dongxi Lv et al.   INTERNATIONAL JOURNAL OF ADVANCED MANUFACTURING TECHNOLOGY

Theoretical study on brittle–ductile transition behavior in elliptical ultrasonic assisted grinding of hard brittle materials

(2016) J.B. Chen et al.   PRECISION ENGINEERING-JOURNAL OF THE INTERNATIONAL SOCIETIES FOR PRECISION ENGINEERING AND NANOTECHNOLOGY

Subsurface damage in high-speed grinding of brittle materials considering kinematic characteristics of the grinding process

(2015) Changchu Wang et al.   INTERNATIONAL JOURNAL OF ADVANCED MANUFACTURING TECHNOLOGY

Effect of grinding wheel spindle vibration on surface roughness and subsurface damage in brittle material grinding

(2015) Jianbin Chen et al.   INTERNATIONAL JOURNAL OF MACHINE TOOLS & MANUFACTURE

Relationship between subsurface damage and surface roughness of glass BK7 in rotary ultrasonic machining and conventional grinding processes

(2012) Dongxi Lv et al.   INTERNATIONAL JOURNAL OF ADVANCED MANUFACTURING TECHNOLOGY

Evaluation of surface cracking in micron and sub-micron scale scratch tests for optical glass BK7

(2011) Weibin Gu et al.   Journal of Mechanical Science and Technology

Evaluation of subsurface crack depth during scratch test for optical glass BK7

(2011) W Gu et al.   PROCEEDINGS OF THE INSTITUTION OF MECHANICAL ENGINEERS PART C-JOURNAL OF MECHANICAL ENGINEERING SCIENCE

Grinding characteristics in high speed grinding of engineering ceramics with brazed diamond wheels

(2010) Jianyi Chen et al.   JOURNAL OF MATERIALS PROCESSING TECHNOLOGY

Fundamental investigation of subsurface damage in single crystalline silicon caused by diamond machining

(2008) Jiwang Yan et al.   PRECISION ENGINEERING-JOURNAL OF THE INTERNATIONAL SOCIETIES FOR PRECISION ENGINEERING AND NANOTECHNOLOGY

Experimental investigation of surface/subsurface damage formation and material removal mechanisms in SiC grinding

(2007) Sanjay Agarwal et al.   INTERNATIONAL JOURNAL OF MACHINE TOOLS & MANUFACTURE