Integrated circuit packaging review with an emphasis on 3D packaging - Peeref

标题

Integrated circuit packaging review with an emphasis on 3D packaging

作者

关键词

-

出版物

INTEGRATION-THE VLSI JOURNAL

Volume 60, Issue -, Pages 204-212

出版商

Elsevier BV

发表日期

2017-11-01

DOI

10.1016/j.vlsi.2017.09.008

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Protocol

Reagent

Reprint

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