Low-Power Implanted Sensor for Orthodontic Bond Failure Diagnosis and Detection

标题
Low-Power Implanted Sensor for Orthodontic Bond Failure Diagnosis and Detection
作者
关键词
-
出版物
IEEE SENSORS JOURNAL
Volume 18, Issue 7, Pages 3003-3009
出版商
Institute of Electrical and Electronics Engineers (IEEE)
发表日期
2018-01-10
DOI
10.1109/jsen.2018.2791426

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