期刊
IEEE JOURNAL OF SOLID-STATE CIRCUITS
卷 53, 期 4, 页码 1089-1101出版社
IEEE-INST ELECTRICAL ELECTRONICS ENGINEERS INC
DOI: 10.1109/JSSC.2017.2782086
关键词
Continuous monitoring; implantable medical devices; implantable sensor; precision health; pressure sensor; ultrasonic communication; ultrasonic power
资金
- DARPA Young Faculty Award
- National Science Foundation (NSF) CAREER Award [ECCS-1454107]
- NSF Graduate Research Fellowships Program [DGE-114747]
A high-precision implantable pressure sensor with ultrasonic power-up and data uplink is presented. The fully packaged implant measures 1.7 x 2.3 x 7.8 mm(3) and includes a custom IC designed in a 180-nm HV BCD process, a pressure transducer, an energy storage capacitor, and a single piezoelectric transducer (piezo). In order to reduce overall dimensions, unique circuit and system design techniques are presented to enable a single time-multiplexed piezo for both power recovery and data uplink transmission. Implant performance is characterized at significant depths, 12 cm in a tissue phantom, offering a > 13x improvement over state of the art in the depth/volume figure of merit, while demonstrating a robust ultrasonic data uplink with better than 10(-) 5 bit error rate. A transient charging analysis is presented to derive the optimal piezo impedance and charging specifications to maximize overall harvesting efficiency. The IC features a front end with a 10-bit SAR ADC achieving a pressure full-scale range of 800 mmHg with a pressure resolution of 0.78 mmHg, exceeding the requirements for a wide range of in vivo pressure sensing applications. The pressure sampling rate is fully externally controlled, up to 1 ksps, in order to significantly decrease implant energy consumption and to allow for adaptable programming for specific applications.
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