期刊
ELECTROCHEMISTRY COMMUNICATIONS
卷 92, 期 -, 页码 29-32出版社
ELSEVIER SCIENCE INC
DOI: 10.1016/j.elecom.2018.05.019
关键词
Fast scanning SPM; Nucleation; Dissolution; Copper
资金
- Ministry of Education, Culture, Sports, Science and Technology [16K14429]
- Iketani Science and Technology Foundation in Japan
- Futaba Electronics Memorial Foundation in Japan
- Hitachi Metals Materials Science Foundation in Japan
- Grants-in-Aid for Scientific Research [16K14429] Funding Source: KAKEN
The initial stages of Cu electrodeposition and dissolution on an Au(100) electrode in sulfuric acid solution were studied by high-speed atomic force microscopy. Dynamic observations revealed that Cu islands formed on the Au terraces within a few seconds. The islands grew to approximately 100 nm as two thick layers overlapped. The AFM height profile results indicated that each layer consisted of 3-8 atomic layers. Dissolution occurred when an anodic potential was applied, with the bottom layer dissolved preferentially. Correlation of these observations with electrochemical data from cyclic voltammetry indicated differences in the rates of deposition and dissolution.
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