Embedding of inkjet-printed Ag-grid/ITO hybrid transparent electrode into a plastic substrate for flexible electronic devices

Flexible ITO/Ag-grid hybrid layers were prepared by a solution process and embedded into a plastic layer. The structural analysis confirmed that the printed layers were successfully embedded into the plastic substrate without any structural damage. The detachment of the printed ITO/Ag-grid layers from the glass substrate was carried out by dissolving a metallic sacrificial layer, which deposited on the glass substrate before the printing step. The optimum electrical and optical performance was obtained with Ag-grid pitch of 300 mu m, leading to the sheet resistance of 2 Omega per sq and the transmittance of 85%.