Thermal performance analysis of a microchannel heat sink cooling with copper oxide-indium (CuO/In) nano-suspensions at high-temperatures

出版年份 2018 全文链接

标题

作者

关键词

出版物

Volume 137, Issue -, Pages 700-709

出版商

Elsevier BV

发表日期

2018-04-08

DOI

10.1016/j.applthermaleng.2018.04.024

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