Review of applications and developments of ultra-thin micro heat pipes for electronic cooling

出版年份 2018 全文链接

标题

作者

关键词

出版物

Volume 223, Issue -, Pages 383-400

出版商

Elsevier BV

发表日期

2018-05-04

DOI

10.1016/j.apenergy.2018.04.072

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