Characterizing drying-induced clayey soil desiccation cracking process using electrical resistivity method

标题
Characterizing drying-induced clayey soil desiccation cracking process using electrical resistivity method
作者
关键词
-
出版物
APPLIED CLAY SCIENCE
Volume 152, Issue -, Pages 101-112
出版商
Elsevier BV
发表日期
2017-11-09
DOI
10.1016/j.clay.2017.11.001

向作者/读者发起求助以获取更多资源

Find the ideal target journal for your manuscript

Explore over 38,000 international journals covering a vast array of academic fields.

Search

Add your recorded webinar

Do you already have a recorded webinar? Grow your audience and get more views by easily listing your recording on Peeref.

Upload Now