Thermal-field effects on interface dynamics and microstructure selection during alloy directional solidification

标题
Thermal-field effects on interface dynamics and microstructure selection during alloy directional solidification
作者
关键词
-
出版物
ACTA MATERIALIA
Volume 150, Issue -, Pages 139-152
出版商
Elsevier BV
发表日期
2018-03-09
DOI
10.1016/j.actamat.2018.03.012

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