Terahertz Band Intra-Chip Communications: Can Wireless Links Scale Modern x86 CPUs?

标题
Terahertz Band Intra-Chip Communications: Can Wireless Links Scale Modern x86 CPUs?
作者
关键词
-
出版物
IEEE Access
Volume 5, Issue -, Pages 6095-6109
出版商
Institute of Electrical and Electronics Engineers (IEEE)
发表日期
2017-04-01
DOI
10.1109/access.2017.2689077

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