Effect of ultrasonic vibration time on the Cu/Sn-Ag-Cu/Cu joint soldered by low-power-high-frequency ultrasonic-assisted reflow soldering

出版年份 2017 全文链接

标题

作者

关键词

Ultrasonic soldering, Vibration time, Reflow, Lead-free, Microstructure, Mechanical properties

出版物

Volume 34, Issue -, Pages 616-625

出版商

Elsevier BV

发表日期

2016-07-02

DOI

10.1016/j.ultsonch.2016.06.039

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