A new validated TRNSYS module for simulating latent heat storage walls

标题

作者

关键词

PCM, Latent heat storage, TRNSYS, Thermal performance, Building envelope, Building simulation

出版物

Volume 109, Issue -, Pages 274-290

出版商

Elsevier BV

发表日期

2015-10-25

DOI

10.1016/j.enbuild.2015.10.013

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