Electroless Ni-plated graphene for tensile strength enhancement of copper

Graphene nanosheets have shown a significant strengthening effect for metal matrixes. In this paper, we develop a novel eletroless plating method to prepare Ni decorated graphene as an enhancing component in a copper matrix. A good dispersion of Ni nanoparticles on graphene sheets is achieved, which effectively enhances the interfacial compatibility between graphene and copper. The electroless plated graphene-copper composite bulk has a better performance in the mechanical tensile strength compared to pure copper, and also maintains superior ductility, elongation and electrical conductivity.