The ICT/electronics question: Structural change and the rebound effect

标题

作者

关键词

Rebound effect, Structural change, Social practice, ICT, Electronics, Transistor, Thermionic valve

出版物

Volume 120, Issue -, Pages 23-31

出版商

Elsevier BV

发表日期

2015-10-23

DOI

10.1016/j.ecolecon.2015.08.020

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