Electrodeposition of porous copper as a substrate for electrocatalytic material

出版年份 2017 全文链接

标题

作者

关键词

Electrodeposition, Porous copper, Hydrogen bubble dynamic template, Electrocatalyst, Electrochemical impedance spectroscopy, Scanning electron microscopy

出版物

JOURNAL OF ELECTROANALYTICAL CHEMISTRY

Volume 785, Issue -, Pages 1-7

出版商

Elsevier BV

发表日期

2016-12-10

DOI

10.1016/j.jelechem.2016.12.013

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