期刊
JOURNAL OF ALLOYS AND COMPOUNDS
卷 699, 期 -, 页码 548-553出版社
ELSEVIER SCIENCE SA
DOI: 10.1016/j.jallcom.2016.12.429
关键词
Selective laser melting (SLM); Al-50Si alloy; Microstructure; Solid solution; Thermal expansion
资金
- National Key Research and Development Program of China [2016YFB0700203]
- National Natural Science Foundation of China [51601109, 51601110, 51375110]
- Youth Teacher Development Program of Shanghai Universities [ZZGCD15100]
As a new preparation technique, selective laser melting (SLM) is applied to fabricate an electronic packaging candidate material, i.e., the Al-50Si alloy. The microstructures of the as-cast and the SLM Al50Si alloys are investigated. The influences of solid solubility on the coefficient of thermal expansion (CTE) of the as-SLM and the heat-treated alloys are investigated. The primary Si can be significantly modified after SLM processing. Moreover, a CTE peak can be observed for the SLM alloy due to the formation of a supersaturated Al(Si) solid solution, which disappears after heat treatment due to Si precipitation. Furthermore, the relationship and differences between theoretical models and the experimentally determined CTE for the Al-50Si alloy will be discussed. (C) 2017 Elsevier B.V. All rights reserved.
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