标题
One-component epoxy adhesive for repair of cell phone board
作者
关键词
-
出版物
JOURNAL OF ADHESION SCIENCE AND TECHNOLOGY
Volume 32, Issue 12, Pages 1278-1286
出版商
Informa UK Limited
发表日期
2017-12-11
DOI
10.1080/01694243.2017.1408547
参考文献
相关参考文献
注意:仅列出部分参考文献,下载原文获取全部文献信息。- Unknown
- (2018) JOURNAL OF POLYMER SCIENCE PART A-POLYMER CHEMISTRY
- Unknown
- (2017) POLYMER INTERNATIONAL
- Unknown
- (2016) JOURNAL OF APPLIED POLYMER SCIENCE
- Unknown
- (2016) JOURNAL OF POLYMER SCIENCE PART A-POLYMER CHEMISTRY
- Unknown
- (2016) JOURNAL OF POLYMER SCIENCE PART A-POLYMER CHEMISTRY
- Synthesis and application of epoxy resins: A review
- (2015) Fan-Long Jin et al. JOURNAL OF INDUSTRIAL AND ENGINEERING CHEMISTRY
- Effect of core–shell rubber (CSR) nano-particles on mechanical properties and fracture toughness of an epoxy polymer
- (2015) Dong Quan et al. POLYMER
- Mechanical performance of full scale steel-timber epoxy joints after exposure to extreme environmental conditions
- (2014) Alberto Cavalli et al. INTERNATIONAL JOURNAL OF ADHESION AND ADHESIVES
- Curing behavior of dicyandiamide/epoxy resin system using different accelerators
- (2013) Mehran Hayaty et al. IRANIAN POLYMER JOURNAL
- Carbonyldiimidazole-accelerated efficient cure of epoxidized soybean oil with dicyandiamide
- (2013) Chun Hua Zhao et al. JOURNAL OF POLYMER SCIENCE PART A-POLYMER CHEMISTRY
- Microencapsulation of imidazole curing agent by solvent evaporation method using W/O/W emulsion
- (2012) Min Jae Shin et al. JOURNAL OF APPLIED POLYMER SCIENCE
- Microencapsulation of imidazole curing agents by spray-drying method using W/O emulsion
- (2012) Min Jae Shin et al. JOURNAL OF APPLIED POLYMER SCIENCE
- Study on reaction kinetics of epoxy resin cured by a modified dicyandiamide
- (2012) Libang Feng et al. JOURNAL OF APPLIED POLYMER SCIENCE
- Microencapsulation of imidazole curing agent for epoxy resin
- (2010) Young Rok Ham et al. JOURNAL OF INDUSTRIAL AND ENGINEERING CHEMISTRY
- Shelf stability of reactive adhesive formulations: A case study for dicyandiamide-cured epoxy systems
- (2009) K. Raetzke et al. INTERNATIONAL JOURNAL OF ADHESION AND ADHESIVES
Find Funding. Review Successful Grants.
Explore over 25,000 new funding opportunities and over 6,000,000 successful grants.
ExploreAsk a Question. Answer a Question.
Quickly pose questions to the entire community. Debate answers and get clarity on the most important issues facing researchers.
Get Started