On a stochastically grain-discretised model for 2D/3D temperature mapping prediction in grinding

出版年份 2017 全文链接

标题

作者

关键词

Grinding, Temperature mapping, Grain-workpiece interaction, Thermocouple array, Temperature model

出版物

Volume 116, Issue -, Pages 60-76

出版商

Elsevier BV

发表日期

2017-01-11

DOI

10.1016/j.ijmachtools.2017.01.004

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