4.6 Article

ESD Behavior of Tunnel FET Devices

期刊

IEEE TRANSACTIONS ON ELECTRON DEVICES
卷 64, 期 1, 页码 28-36

出版社

IEEE-INST ELECTRICAL ELECTRONICS ENGINEERS INC
DOI: 10.1109/TED.2016.2630079

关键词

Band-to-band tunneling (BTBT); electrostatic discharge (ESD); tunnel FET

资金

  1. Department of Science and Technology, Government of India

向作者/读者索取更多资源

For the first time, we present the electrostatic discharge (ESD) behavior of grounded gate tunnel FET (ggTFET) with detailed physical insight into the device operation, 3-D filamentation and failure under ESD stress conditions. Current as well as time evolution of the junction breakdown, device turn-ON, voltage snapback, and finally the unique failure mechanism is studied using both 2-D and 3-D technologycomputer aided design simulations. The interaction between the band-to-band tunneling, avalanche multiplication, and thermal carrier generation leading to voltage snapback and failure is presented in detail. In addition, electro-thermal instability initiated filamentation and snapback discovered in the ggTFET is explained. The impact of various technology and device design parameters on the ESD behavior and robustness of TFETs is discussed. This has helped developing guidelines to design ESD robust TFETs for efficient protection concepts. Finally, the charge device model behavior of ggTFET device is discussed.

作者

我是这篇论文的作者
点击您的名字以认领此论文并将其添加到您的个人资料中。

评论

主要评分

4.6
评分不足

次要评分

新颖性
-
重要性
-
科学严谨性
-
评价这篇论文

推荐

暂无数据
暂无数据