期刊
IEEE ELECTRON DEVICE LETTERS
卷 38, 期 1, 页码 95-98出版社
IEEE-INST ELECTRICAL ELECTRONICS ENGINEERS INC
DOI: 10.1109/LED.2016.2634528
关键词
Dynamic ON-resistance; field plate; GaN HEMT; power switch
资金
- Defense Advanced Research Projects Agency (DARPA) Microscale Power Conversion (MPC) program [FA8650-11-C-7181]
In this letter, we discuss a novel asymmetric field plate structure utilizing a slanted field plate ( FP) engineered to appropriately distribute the electric field on GaN high-electron mobility transistors (HEMTs) scaled for low-loss, high-speed power switch applications. A uniform electric field distribution achieved with the slant FP enables an optimum device design, where a low-dynamic ON-resistance (R-on,R- dyn) and high breakdown voltage are obtained simultaneously by minimizing the gate-drain distance. The optimized FP design demonstrated a low R-on,R- dyn of 2.3 (2.1) Omega-mm at a quiescent drain voltage of 50V in E-mode (D-mode) HEMTs with a breakdown voltage of 138 V (146 V). The corresponding high-frequency performance of E-mode (D-mode) HEMTs of peak f(T)/f(max) = 41/100GHz (53/100GHz) yielded a decent R(on, dyn)xQg product in the range of 31.0-34.5 (28.0-33.3) m Omega-nC. This new slant FP technology combined with scaled epitaxial structure (for short L-g) and reduced access resistances, using n+ GaN ohmic contacts, greatly enhances performance and design flexibility of high-speed, low-loss, GaN power switch devices.
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