Modeling a copper/carbon nanotube composite for applications in electronic packaging

出版年份 2015 全文链接

标题

作者

关键词

Copper/carbon nanotube composite, Modeling, Current density, Through silicon vias, Electronic packaging

出版物

Volume 97, Issue -, Pages 1-5

出版商

Elsevier BV

发表日期

2014-10-24

DOI

10.1016/j.commatsci.2014.10.014

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