Self-reducible copper inks composed of copper–amino complexes and preset submicron copper seeds for thick conductive patterns on a flexible substrate

Low-pressure Cu-Cu bonding using in-situ surface-modified microscale Cu particles for power device packaging

(2016) Xiangdong Liu et al.   SCRIPTA MATERIALIA

Nanoparticle chemisorption printing technique for conductive silver patterning with submicron resolution

(2016) Toshikazu Yamada et al.   Nature Communications

Self-reduction of a copper complex MOD ink for inkjet printing conductive patterns on plastics

(2015) Yousef Farraj et al.   CHEMICAL COMMUNICATIONS

High-concentration copper nanoparticles synthesis process for screen-printing conductive paste on flexible substrate

(2015) Sze Kee Tam et al.   JOURNAL OF NANOPARTICLE RESEARCH

Effect of the Amine Concentration on Phase Evolution and Densification in Printed Films Using Cu(II) Complex Ink

(2015) Yun-Hyuk Choi et al.   LANGMUIR

A highly sensitive and flexible pressure sensor with electrodes and elastomeric interlayer containing silver nanowires

(2015) Jun Wang et al.   Nanoscale

Flash light sintered copper precursor/nanoparticle pattern with high electrical conductivity and low porosity for printed electronics

(2015) Wan-Ho Chung et al.   THIN SOLID FILMS

A Self-Reducible and Alcohol-Soluble Copper-Based Metal–Organic Decomposition Ink for Printed Electronics

(2014) Dong-Hun Shin et al.   ACS Applied Materials & Interfaces

Heterogeneous nucleation and shape transformation of multicomponent metallic nanostructures

(2014) Soon Gu Kwon et al.   NATURE MATERIALS

Copper inks formed using short carbon chain organic Cu-precursors

(2014) Wen-dong Yang et al.   RSC Advances

Cu Ion Ink for a Flexible Substrate and Highly Conductive Patterning by Intensive Pulsed Light Sintering

(2013) Byung-Yong Wang et al.   ACS Applied Materials & Interfaces

Facile Preparation of Monodisperse, Impurity-Free, and Antioxidation Copper Nanoparticles on a Large Scale for Application in Conductive Ink

(2013) Yu Zhang et al.   ACS Applied Materials & Interfaces

Copper Nanoparticles: Aqueous Phase Synthesis and Conductive Films Fabrication at Low Sintering Temperature

(2013) Dunying Deng et al.   ACS Applied Materials & Interfaces

Cu Salt Ink Formulation for Printed Electronics using Photonic Sintering

(2013) Teppei Araki et al.   LANGMUIR

Synthesis of oxidation-resistant core–shell copper nanoparticles

(2013) Inhyuk Kim et al.   RSC Advances

Synthesis of low-temperature-processable and highly conductive Ag ink by a simple ligand modification: the role of adsorption energy

(2013) Inyu Jung et al.   Journal of Materials Chemistry C

Direct Writing Patterns for Electroless Plated Copper Thin Film on Plastic Substrates

(2012) Ying-Chih Liao et al.   ACS Applied Materials & Interfaces

Highly conductive polymer-decorated Cu electrode films printed on glass substrates with novel precursor-based inks and pastes

(2012) Yun-Hyuk Choi et al.   JOURNAL OF MATERIALS CHEMISTRY

Electrically conductive copper film prepared at low temperature by thermal decomposition of copper amine complexes with various amines

(2012) Akihiro Yabuki et al.   MATERIALS RESEARCH BULLETIN

In situmonitoring of flash-light sintering of copper nanoparticle ink for printed electronics

(2012) Hyun-Jun Hwang et al.   NANOTECHNOLOGY

Conductive Inks with a “Built-In” Mechanism That Enables Sintering at Room Temperature

(2011) Michael Grouchko et al.   ACS Nano

Pen-on-Paper Flexible Electronics

(2011) Analisa Russo et al.   ADVANCED MATERIALS

Fabrication of silver nanowire transparent electrodes at room temperature

(2011) Takehiro Tokuno et al.   Nano Research

Low-temperature synthesis of copper conductive film by thermal decomposition of copper–amine complexes

(2011) Akihiro Yabuki et al.   THIN SOLID FILMS

Effect of copper concentration in printable copper inks on film fabrication

(2011) Suk Jun Kim et al.   THIN SOLID FILMS

Effect of Complex Agent on Characteristics of Copper Conductive Pattern Formed by Ink-jet Printing

(2010) Young-In Lee et al.   JAPANESE JOURNAL OF APPLIED PHYSICS

A low-cure-temperature copper nano ink for highly conductive printed electrodes

(2009) Byoungyoon Lee et al.   CURRENT APPLIED PHYSICS

Sintering of inkjet printed copper nanoparticles for flexible electronics

(2009) Seonhee Jang et al.   SCRIPTA MATERIALIA

Controlling the Thickness of the Surface Oxide Layer on Cu Nanoparticles for the Fabrication of Conductive Structures by Ink-Jet Printing

(2008) Sunho Jeong et al.   ADVANCED FUNCTIONAL MATERIALS

Scalable Assembly Method of Vertically-Suspended and Stretched Carbon Nanotube Network Devices for Nanoscale Electro-Mechanical Sensing Components

(2008) Byung Yang Lee et al.   NANO LETTERS

Large-scale synthesis of copper nanoparticles by chemically controlled reduction for applications of inkjet-printed electronics

(2008) Youngil Lee et al.   NANOTECHNOLOGY