期刊
IEEE JOURNAL OF BIOMEDICAL AND HEALTH INFORMATICS
卷 20, 期 1, 页码 73-81出版社
IEEE-INST ELECTRICAL ELECTRONICS ENGINEERS INC
DOI: 10.1109/JBHI.2014.2370646
关键词
Electrode-scalp impedance; electroencephalography (EEG); event-related potential (ERP); hierarchical clustering; independent component analysis (ICA)
类别
资金
- Texas Analog Center of Excellence (TxACE) [1836.103]
Electroencephalography (EEG) is the recording of electrical activity produced by the firing of neurons within the brain. These activities can be decoded by signal processing techniques. However, EEG recordings are always contaminated with artifacts which hinder the decoding process. Therefore, identifying and removing artifacts is an important step. Researchers often clean EEG recordings with assistance from independent component analysis (ICA), since it can decompose EEG recordings into a number of artifact-related and event-related potential (ERP)-related independent components. However, existing ICA-based artifact identification strategies mostly restrict themselves to a subset of artifacts, e.g., identifying eye movement artifacts only, and have not been shown to reliably identify artifacts caused by nonbiological origins like high-impedance electrodes. In this paper, we propose an automatic algorithm for the identification of general artifacts. The proposed algorithm consists of two parts: 1) an event-related feature-based clustering algorithm used to identify artifacts which have physiological origins; and 2) the electrodescalp impedance information employed for identifying nonbiological artifacts. The results on EEG data collected from ten subjects show that our algorithm can effectively detect, separate, and remove both physiological and nonbiological artifacts. Qualitative evaluation of the reconstructed EEG signals demonstrates that our proposed method can effectively enhance the signal quality, especially the quality of ERPs, even for those that barely display ERPs in the raw EEG. The performance results also show that our proposed method can effectively identify artifacts and subsequently enhance the classification accuracies compared to four commonly used automatic artifact removal methods.
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