On the kinetics of copper electroless plating with hypophosphite reductant

标题
On the kinetics of copper electroless plating with hypophosphite reductant
作者
关键词
-
出版物
SURFACE ENGINEERING
Volume 32, Issue 5, Pages 363-371
出版商
Informa UK Limited
发表日期
2015-05-16
DOI
10.1179/1743294415y.0000000066

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