Correlative microstructure and topography informed nanoindentation of copper films

出版年份 2016 全文链接

标题

作者

关键词

Copper metallization, Local mechanical behaviour, Nanoindentation, Grain boundaries, Contact mechanics

出版物

Volume 308, Issue -, Pages 404-413

出版商

Elsevier BV

发表日期

2016-08-30

DOI

10.1016/j.surfcoat.2016.07.104

联系作者

Interested in hosting your own webinar? Check the schedule and propose your idea to the Peeref Content Team.

Create Now

Quickly pose questions to the entire community. Debate answers and get clarity on the most important issues facing researchers.

Get Started