Life cycle analysis on sequential recovery of copper and gold from waste printed circuit boards
出版年份 2023 全文链接
标题
Life cycle analysis on sequential recovery of copper and gold from waste printed circuit boards
作者
关键词
-
出版物
Waste Management
Volume 171, Issue -, Pages 621-627
出版商
Elsevier BV
发表日期
2023-10-13
DOI
10.1016/j.wasman.2023.10.008
参考文献
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