4.3 Article

Microstructure and properties of ultrasonic-assisted gallium-based alloys for room-temperature bonding of Cu/Cu

期刊

PHILOSOPHICAL MAGAZINE LETTERS
卷 103, 期 1, 页码 -

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TAYLOR & FRANCIS LTD
DOI: 10.1080/09500839.2023.2230955

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GaIn liquid alloy; ultrasonic bonding; room-temperature welding; microstructure

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Room-temperature welding with gallium is a new strategy due to its low melting point and affinity for intermetallic compound formation. By employing liquid gallium-based solder and ultrasonic drive, Cu/Cu diffusion-bond connections can be quickly formed. The characteristics of weld quality were preliminarily clarified, and further research directions were determined.
Room-temperature welding with gallium is regarded as a new strategy because of the low melting point of gallium and its affinity for forming intermetallic compounds with other metals. Benefitting from liquid gallium-based solder and an ultrasonic drive, the establishment of Cu/Cu diffusion-bond connections can be quickly completed. The underlying characteristics for the weld quality of room-temperature bonding were preliminarily clarified from the perspectives of welding process parameters and the solder composition. To further determine these characteristics, the research directions including features of welding product formed by ultrasonic-driven room-temperature bonding, the interface microstructure, the element distribution and the shear strength of the weld joint were then determined.

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