Design and optimization of high flexible motion profile for high acceleration to reduce vibration

With the growing development of surface mounted technology, the precision and efficiency of chips packaging, especially chips placing, have become the focus of attention. The chips placing is a high-velocity and high-dynamic point-to-point motion, and the discontinuous motion is easy to exist vibration, seriously affecting the accuracy of the patch. To reduce the vibration during chips placing, the high-flexible motion profile with continuous acceleration is designed based on quintic polynomial under the kinematic constraints. Then, considering the efforts of different motion parameters on operating vibrations, the optimization objective function is constructed to obtain the optimal combination of velocity and acceleration. Finally, the amplitude-frequency characteristics of different motion profiles are analyzed and compared to verify the superiority of the proposed profile and the correctness of the proposed optimization method. The simulation and experimental results show that the motion profile with optimal parameters has lower amplitude of low frequency, which can reduce the vibration amplitude, improving the accuracy of chips placing.

Automated summary

With the development of surface mounted technology, the precision and efficiency of chips placing have become a focus of attention. A high-flexible motion profile is designed to reduce vibrations, and an optimization objective function is constructed to obtain the optimal combination of velocity and acceleration. The results show that the motion profile with optimal parameters can reduce vibration amplitude and improve the accuracy of chips placing.