Stress analysis of airgaps under process-induced thermo-mechanical loads

标题
Stress analysis of airgaps under process-induced thermo-mechanical loads
作者
关键词
Airgap, Ultra low-k dielectric (ULK), Interconnect, Finite element model (FEM)
出版物
MICROELECTRONIC ENGINEERING
Volume 156, Issue -, Pages 70-77
出版商
Elsevier BV
发表日期
2016-02-16
DOI
10.1016/j.mee.2016.02.019

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