What’s Up With Integrated Packaging and Wireless Power: MTT-S Inter-Society Technology Panels at IMS 2023 [Conference Report]

出版年份 2023 全文链接

标题

作者

关键词

出版物

Volume 24, Issue 11, Pages 77-78

出版商

Institute of Electrical and Electronics Engineers (IEEE)

发表日期

2023-10-10

DOI

10.1109/mmm.2023.3311647

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