Article
Materials Science, Multidisciplinary
Emad M. A. Ahmed, Mohammed A. Amin, Norah I. A. Abou Tubaylah
Summary: The binary and ternary solder alloys prepared by melt spinning technique exhibit ultrafine microstructures, with significant impacts of Ag content on the microstructures and properties of the alloys, resulting in lowered melting points and improved hardness due to microstructure refinements.
APPLIED PHYSICS A-MATERIALS SCIENCE & PROCESSING
(2021)
Article
Materials Science, Multidisciplinary
S. Sha, J. Chang, S. S. Xu, P. X. Yan, B. Wei
Summary: In this study, the microstructural dependence of magnetic property for hypereutectic Co62Mo38 alloy was investigated by undercooling the alloy using electromagnetic levitation and drop tube techniques. The results showed that as the undercooling increased, the alloy exhibited significant changes in magnetic properties, with a decrease in saturation magnetization and a reduction in coercive force. At small undercoolings, the alloy consisted mainly of lath-shaped primary epsilon-Co7Mo6 dendrites, while at higher undercoolings, the volume fraction of alpha-Co phase decreased continuously.
Article
Chemistry, Physical
D. Ezemenaka, C. Patino, A. Genau
Summary: This research focuses on the microstructure evolution and pattern formation in multi-component, multi-phase metallic materials during freezing, specifically investigating the solidification behavior of the three-phase Al-Cu-Mg eutectic. Results show that the stability of three-phase coupled growth in this system is influenced by velocity, gradient, and composition, with comparisons made to thermodynamically predicted values. Unlike the related Al-Ag-Cu eutectic system, thermal gradient was found to have no measurable effect on eutectic spacing or pattern in this study.
JOURNAL OF ALLOYS AND COMPOUNDS
(2021)
Article
Materials Science, Multidisciplinary
Y. Cui, J. W. Xian, A. Zois, K. Marquardt, H. Yasuda, C. M. Gourlay
Summary: The factors affecting the nucleation and morphology of large Ag3Sn plates in solder joints are not well understood. This study investigates the faceted solidification of Ag3Sn and reveals transitions from single crystal plates to cyclic twinned plates and highly branched structures. Real-time X-ray imaging confirms that Ag3Sn cyclic twins originate from a common point during nucleation or the early stages of growth. Soldering to copper substrates catalyzes Ag3Sn nucleation through constitutional supercooling and geometrical catalysis.
Article
Chemistry, Physical
Daria Drozdenko, Michiaki Yamasaki, Kristian Mathis, Patrik Dobron, Shin-ichi Inoue, Yoshihito Kawamura
Summary: This study focused on the relationship between microstructure and corrosion dynamics in dilute Mg97.94Zn0.56Y1.5 alloys prepared by the consolidation of rapidly solidified ribbons. The dynamics of corrosion were monitored using electrochemical methods and acoustic emission techniques. Results showed that internal strain distribution, grain morphology, and distribution of secondary phases play a significant role in the corrosion process.
Article
Materials Science, Multidisciplinary
T. Gancarz, A. Dobosz, A. -A. Bogno, G. Cempura, N. Schell, R. Chulist, H. Henein
Summary: This study investigated the thermophysical properties and rapid solidification of Al5.0Mg0.2Sc alloys with varying Li content using discharge crucible and Impulse Atomization techniques. It was found that density and surface tension decrease with increasing Li content, while viscosity increases due to short-range ordering in intermetallic phases. The analysis revealed the precipitation of Al3Sc and Al2MgLi phases in both alloy compositions, as well as the presence of AlLi precipitates in the Al5.0Mg0.2Sc6.0Li alloy, consistent with the phase diagram.
MATERIALS CHARACTERIZATION
(2021)
Article
Engineering, Manufacturing
Rafael Kakitani, Cassio Augusto Pinto da Silva, Bismarck Silva, Amauri Garcia, Noe Cheung, Jose Eduardo Spinelli
Summary: This paper aims to predict the impact of the velocities and gradients of eutectic growth projects on microstructures, and establishes cooling rate diagrams for Sn-Cu and Sn-Bi alloys to provide comprehensive analyses of subsequent microstructures.
SOLDERING & SURFACE MOUNT TECHNOLOGY
(2022)
Article
Engineering, Electrical & Electronic
S. L. A. Dantas, A. L. R. Souza, J. E. Spinelli, M. A. Correa, B. L. Silva
Summary: This study investigates the effect of Ni content on the microstructure and electrical resistivity of Sn-0.7wt.%Cu-xNi alloys. It is found that the addition of Ni can decrease the electrical resistivity and refine the microstructure.
JOURNAL OF ELECTRONIC MATERIALS
(2023)
Article
Materials Science, Multidisciplinary
P. X. Yan, J. Chang, W. L. Wang, X. N. Zhu, M. J. Lin, B. Wei
Summary: The liquid CoCrFeNiMo0.8 high entropy alloy (HEA) undergoes undercooling and solidifies rapidly. The transition from slow lamellar eutectic growth to rapid anomalous eutectic growth is observed, which affects crystal orientation and mechanical properties. The growth mechanism transition is due to independent nucleation and cooperative branched growth of the two eutectic phases. The structural refinement and increase in volume fraction of anomalous eutectic contribute to the improved hardness, compression strength, and ductility of the alloy.
Article
Materials Science, Multidisciplinary
Jeverton Laureano Paixao, Rai Batista de Sousa, Bruno Silva Sobral, Rubiamara Mauricio de Sousa, Jefferson Romaryo Duarte da Luz, Jose Eduardo Spinelli, Bismarck Luiz Silva
Summary: This study investigates the effects of zinc additions on the properties of Sn-Cu alloys. The results show that zinc can improve the microstructure of the alloy, but has limited impact on the cytotoxicity levels.
MATERIALS CHARACTERIZATION
(2023)
Article
Chemistry, Physical
Thiago Soares, Clarissa Cruz, Marcella Xavier, Rodrigo Reyes, Felipe Bertelli, Amauri Garcia, Jose E. Spinelli, Noe Cheung
Summary: The Bi-Sb system alloys exhibit high corrosion resistance and good wettability, making them promising for lead-free solder alloys. The simplicity of the phase diagram and the formation of the (Bi,Sb) phase are characteristics of this system. The research demonstrates the application of a numerical mathematical model for thermal interface conductance and the results of wetting and interfacial reaction layer formation in Bi-5 wt% Sb alloy on different substrate materials.
JOURNAL OF ALLOYS AND COMPOUNDS
(2021)
Article
Materials Science, Multidisciplinary
Yubin Kang, Jin-Ju Choi, Dae-Guen Kim, Hyun-Woo Shim
Summary: This study investigated the effects of adding Bi and Zn on the mechanical properties of Sn-Ag-Cu lead-free alloy. The results showed that adding Bi and Zn could increase the tensile strength of the alloy while decreasing its electrical conductivity and elongation at break. It was found that adding Bi could reduce the activation energy required for the formation of intermetallic compounds, while adding Zn could refine the grain structure.
Article
Engineering, Electrical & Electronic
Mehdi Raza, Lee Shewchenko, Ayodele Olofinjana, Damon Kent, Jitendra Mata, Rezwanul Haque
Summary: The research focuses on the mechanical properties of lead-free solder with increasing Bi substitution, showing that fracture strength peaks at 60MPa between 1.4% and 1.8% Bi, and reaches nearly 80MPa at 2% Bi with gradual increase up to 93MPa at 7% Bi. X-ray diffraction and small-angle neutron scattering reveal microstructural differences at length scales of 10-100 nm in alloys with Bi content between 0.8-1.5wt%.
JOURNAL OF MATERIALS SCIENCE-MATERIALS IN ELECTRONICS
(2021)
Article
Materials Science, Multidisciplinary
Qingsong Tong, Jing Ge, Maohua Rong, Jielong Li, Jian Jiao, Lu Zhang, Jiang Wang
Summary: In this work, thermodynamic modeling of the Ag-Cu-Sn ternary system was performed using the CALPHAD method, and a set of self-consistent thermodynamic parameters was obtained.
Article
Chemistry, Physical
Pinhui Lv, Richu Wang, Chaoqun Peng, Zhiyong Cai, Yan Feng, Xiaofeng Wang
Summary: Pre-strain deformation before artificial aging is preferred for fabricating high-performance Al-Cu-Li alloy plates. The precipitation and mechanical properties of rapidly solidified Al-Cu-Li alloy as a function of pre -rolling deformation from 4% to 20% were investigated. The increase in pre-rolling deformation leads to higher dislocation density, providing more nucleation sites for the T1 phase, resulting in higher density and finer diameter of the T1 phase in grains and mitigated enrichment of T1 phase at the subgrain boundaries. Meanwhile, more T1 phase consumes more Cu atoms, suppressing the precipitation of the 0' phase. The yield strength of the alloy increases with the pre-rolling deformation, reaching a maximum value of 641.6 MPa after 20% pre-rolling, attributed to strain hardening and precipitation strengthening. The strengthening contribution of the T1 phase decreases with increasing pre-rolling deformation, while the increase in yield strength is due to larger strain hardening from high levels of pre-rolling deformation.
JOURNAL OF ALLOYS AND COMPOUNDS
(2022)
