Electrodeposited Palladium Coating on Co Micro-Nano Cones Array for Low-Temperature Solid-State Bonding

The influence of solder oxidation on low-temperature solid-state bonding based on Ni micro-nano cones

(2022) Yan Peng et al.   APPLIED SURFACE SCIENCE

Nanotwinned copper micro-cone array fabricated by pulse electrodeposition for low-temperature bonding

(2021) Mengya Dong et al.   MATERIALS LETTERS

Recent progress in SLID bonding in novel 3D-IC technologies

(2019) Lei Sun et al.   JOURNAL OF ALLOYS AND COMPOUNDS

Low-Temperature Cu-Cu Bonding Using Silver Nanoparticles Fabricated by Physical Vapor Deposition

(2017) Zijian Wu et al.   JOURNAL OF ELECTRONIC MATERIALS

Ultra-thin Ti passivation mediated breakthrough in high quality Cu-Cu bonding at low temperature and pressure

(2016) Asisa Kumar Panigrahi et al.   MATERIALS LETTERS

A low-temperature solid-state bonding method based on copper bump coated with nickel microcones and silver buffer

(2016) Fengtian Hu et al.   MATERIALS LETTERS

Electroless Silver Coating on Copper Microcones for Low-Temperature Solid-State Bonding

(2015) Fengtian Hu et al.   JOURNAL OF ELECTRONIC MATERIALS

Preparation and characterization of nickel–cobalt alloy nanostructures array fabricated by electrodeposition

(2014) Ning Wang et al.   CRYSTENGCOMM

Solid state diffusion between Sn and Cu microcones on Cu microcones

(2013) Yi Huang et al.   JOURNAL OF ALLOYS AND COMPOUNDS

Electrodeposited Ni microcones with a thin Au film bonded with Au wire

(2013) Shixin Gao et al.   JOURNAL OF MATERIALS PROCESSING TECHNOLOGY

Low-temperature solid state bonding method based on surface Cu–Ni alloying microcones

(2012) Qin Lu et al.   APPLIED SURFACE SCIENCE

Low-Temperature Solid State Bonding of Sn and Nickel Micro Cones for Micro Interconnection

(2012) Z. Chen et al.   ECS Solid State Letters

Preparation of super-hydrophobic Cu/Ni coating with micro-nano hierarchical structure

(2011) Wenjing Zhang et al.   MATERIALS LETTERS

Low temperature CuCu thermo-compression bonding with temporary passivation of self-assembled monolayer and its bond strength enhancement

(2011) C.S. Tan et al.   MICROELECTRONICS RELIABILITY

Structural control of a cobalt nanocone array grown by directional electrodeposition

(2010) Tao Hang et al.   CRYSTENGCOMM

Growth Mechanism and Field Emission Properties of Nickel Nanocones Array Fabricated by One-Step Electrodeposition

(2010) Tao Hang et al.   JOURNAL OF THE ELECTROCHEMICAL SOCIETY

Fabrication of ordered Ni nanocones using a porous anodic alumina template

(2008) T. Nagaura et al.   ELECTROCHEMISTRY COMMUNICATIONS