Elucidating microstructure of spinodal copper alloy through annealing

标题

作者

关键词

Microstructure, Grain boundary engineering, Electron backscatter diffraction, Spinodal copper alloy, Annealing twin

出版物

MATERIALS CHARACTERIZATION

Volume 120, Issue -, Pages 152-158

出版商

Elsevier BV

发表日期

2016-08-27

DOI

10.1016/j.matchar.2016.08.021

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