Engineering the electronic structure on MXenes via multidimensional component interlayer insertion for enhanced electromagnetic shielding
出版年份 2022 全文链接
标题
Engineering the electronic structure on MXenes via multidimensional component interlayer insertion for enhanced electromagnetic shielding
作者
关键词
-
出版物
JOURNAL OF MATERIALS SCIENCE & TECHNOLOGY
Volume 138, Issue -, Pages 149-156
出版商
Elsevier BV
发表日期
2022-09-20
DOI
10.1016/j.jmst.2022.07.047
参考文献
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