BENDING FATIGUE BEHAVIOR OF AG NANOWIRE/CU THIN-FILM HYBRID INTERCONNECTS FOR WEARABLE ELECTRONICS

标题
BENDING FATIGUE BEHAVIOR OF AG NANOWIRE/CU THIN-FILM HYBRID INTERCONNECTS FOR WEARABLE ELECTRONICS
作者
关键词
-
出版物
出版商
University of Nis
发表日期
2022-12-01
DOI
10.22190/fume220730040h

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