Modeling of thermal damage and residual stress in slicing of silicon wafers using wire-electrical discharge machining: Comparison with experiments

标题
Modeling of thermal damage and residual stress in slicing of silicon wafers using wire-electrical discharge machining: Comparison with experiments
作者
关键词
-
出版物
Journal of Manufacturing Processes
Volume 85, Issue -, Pages 69-79
出版商
Elsevier BV
发表日期
2022-11-23
DOI
10.1016/j.jmapro.2022.10.079

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