Temperature Dependent Band Gap Correction Model Using Tight-Binding Approach for UTB Device Simulations

标题
Temperature Dependent Band Gap Correction Model Using Tight-Binding Approach for UTB Device Simulations
作者
关键词
-
出版物
IEEE TRANSACTIONS ON NANOTECHNOLOGY
Volume 22, Issue -, Pages 8-13
出版商
Institute of Electrical and Electronics Engineers (IEEE)
发表日期
2022-12-30
DOI
10.1109/tnano.2022.3232778

向作者/读者发起求助以获取更多资源

Publish scientific posters with Peeref

Peeref publishes scientific posters from all research disciplines. Our Diamond Open Access policy means free access to content and no publication fees for authors.

Learn More

Add your recorded webinar

Do you already have a recorded webinar? Grow your audience and get more views by easily listing your recording on Peeref.

Upload Now