Impact of Chip-Edge Structures on Alignment Accuracies of Self-Assembled Dies for Microelectronic System Integration

标题
Impact of Chip-Edge Structures on Alignment Accuracies of Self-Assembled Dies for Microelectronic System Integration
作者
关键词
-
出版物
JOURNAL OF MICROELECTROMECHANICAL SYSTEMS
Volume 25, Issue 1, Pages 91-100
出版商
Institute of Electrical and Electronics Engineers (IEEE)
发表日期
2015-11-05
DOI
10.1109/jmems.2015.2480787

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