期刊
出版社
ELSEVIER SCIENCE SA
DOI: 10.1016/j.msea.2022.143957
关键词
Directional solidification; Plastic deformation; Microstructure; Nano twins
类别
资金
- National Natural Science Foundation of China [U21A2051, 52173297, 52071133]
- R & D Projects of Henan Academy of Sciences [220910009]
- Key R & D and Promotion Projects of Henan Province [212102210441, 214400510028]
This study investigates the evolution of strength and microstructure in Cu-20Ag alloy during wire drawing process. The lamellar structures and the formation of nano-twins resulting from these structures have been found to significantly increase the wire's strength. Additionally, when the wire diameter is less than 2.95 mm, strengthening is mainly achieved through grain size refinement.
This study deals with the evolution of strength and microstructure in Cu-20Ag alloy during wire drawing from an initial diameter of 7.84 mm-0.02 mm. The final wire had a strength of 1670 MPa and 53.8% of the conductivity of international annealed copper standard (IACS). Electron backscattering diffraction (EBSD) and transmission electron microscope (TEM) were used for microstructural characterization in the later stages of deformation, we found that many boundaries resulting from the lamellar structures and the occurrence of nano-twins formed in the lamellar improved the strength of the wire. When the wire diameter is less than 2.95 mm,with an essentially constant dislocation density, the strength can be related solely to strengthening boundaries by a grain size refinement. The strengthening mechanism of the wire during cumulative strain is discussed.
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