Reduction of the water wettability of Cu films deposited on liquid surfaces by thermal evaporation

标题
Reduction of the water wettability of Cu films deposited on liquid surfaces by thermal evaporation
作者
关键词
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出版物
出版商
Elsevier BV
发表日期
2022-06-24
DOI
10.1016/j.colsurfa.2022.129569

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