Printed Circuit Board Surface Finish and Effects of Chloride Contamination, Electric Field, and Humidity on Corrosion Reliability

Solder Flux Residues and Humidity-Related Failures in Electronics: Relative Effects of Weak Organic Acids Used in No-Clean Flux Systems

(2015) Vadimas Verdingovas et al.   JOURNAL OF ELECTRONIC MATERIALS

Table of Contents

(2014)   IEEE TRANSACTIONS ON DEVICE AND MATERIALS RELIABILITY

Impact of NaCl Contamination and Climatic Conditions on the Reliability of Printed Circuit Board Assemblies

(2014) Vadimas Verdingovas et al.   IEEE TRANSACTIONS ON DEVICE AND MATERIALS RELIABILITY

Influence of sodium chloride and weak organic acids (flux residues) on electrochemical migration of tin on surface mount chip components

(2013) V. Verdingovas et al.   CORROSION ENGINEERING SCIENCE AND TECHNOLOGY

Corrosion failure due to flux residues in an electronic add-on device

(2010) Morten S. Jellesen et al.   ENGINEERING FAILURE ANALYSIS

Hygroscopic Growth and Deliquescence of NaCl Nanoparticles Mixed with Surfactant SDS

(2010) Christopher W. Harmon et al.   JOURNAL OF PHYSICAL CHEMISTRY B

Electrochemical Migration on Electronic Chip Resistors in Chloride Environments

(2009) D. Minzari et al.   IEEE TRANSACTIONS ON DEVICE AND MATERIALS RELIABILITY