Combining covalent bonding interface among different components and controlled orientation of one-dimensional nanofibers for high energy density nanocomposites

Dielectric materials with high breakdown strength and excellent dielectric properties have attracted great attention because of their crucial importance in improving energy storage. In this study, a novel method for constructing covalent bonds at the interface of BaTiO3 nanofibers (BT NFs) and fluoropolymer to improve the interfacial adhesion is proposed, in combination with the orientation of one-dimensional BT NFs to improve the energy storage density. It was found that the cross-linked nanocomposites containing covalent bonding interface between thiol-modified BaTiO3 nanofibers (BT-SH NFs) and olefin-modified poly(vinylidene fluoride-chlorotrifluoroethylene) exhibited the supreme compatibility. In addition, the nanocomposite, in which the BT-SH NFs are oriented perpendicular to the electric field, is obtained by stretching, and its breakdown strength is increased by 7.1%. Consequently, the stretched nanocomposite with 5 vol% BT-SH NFs loading achieved a high discharged energy density of 17.1 J/cm(3). The synergistic effect of cross-linking and stretching treatment accompanied by covalent bonding interface provides a novel strategy for manufacturing high-performance dielectric nanocomposites.

Automated summary

In this study, a novel method for improving the interfacial adhesion of nanocomposites and increasing the energy storage density was proposed and demonstrated. The use of thiol-modified BaTiO3 nanofibers (BT-SH NFs) and olefin-modified poly(vinylidene fluoride-chlorotrifluoroethylene) resulted in nanocomposites with superior compatibility. Additionally, stretching the nanocomposites and orienting the fibers perpendicular to the electric field increased the breakdown strength. The stretched nanocomposite with 5 vol% BT-SH NFs loading achieved a high discharged energy density of 17.1 J/cm(3). The strategy of cross-linking and stretching treatment accompanied by covalent bonding interface provides a new approach for manufacturing high-performance dielectric nanocomposites.