Versatile Thermal‐Solidifying Direct‐Write Assembly towards Heat‐Resistant 3D‐Printed Ceramic Aerogels for Thermal Insulation

标题
Versatile Thermal‐Solidifying Direct‐Write Assembly towards Heat‐Resistant 3D‐Printed Ceramic Aerogels for Thermal Insulation
作者
关键词
-
出版物
Small Methods
Volume 6, Issue 5, Pages 2200045
出版商
Wiley
发表日期
2022-03-28
DOI
10.1002/smtd.202200045

向作者/读者发起求助以获取更多资源

Add your recorded webinar

Do you already have a recorded webinar? Grow your audience and get more views by easily listing your recording on Peeref.

Upload Now

Become a Peeref-certified reviewer

The Peeref Institute provides free reviewer training that teaches the core competencies of the academic peer review process.

Get Started