标题
Improving the interfacial bonding of CNT/Cu composites using CPD bridges
作者
关键词
Carbon nanotube (CNT), Carbonized polymer dot (CPD), Copper matrix composites, Strengthening mechanism, Electrical conductivity
出版物
MATERIALS SCIENCE AND ENGINEERING A-STRUCTURAL MATERIALS PROPERTIES MICROSTRUCTURE AND PROCESSING
Volume 845, Issue -, Pages 143222
出版商
Elsevier BV
发表日期
2022-04-28
DOI
10.1016/j.msea.2022.143222
参考文献
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