Improving the interfacial bonding of CNT/Cu composites using CPD bridges

标题
Improving the interfacial bonding of CNT/Cu composites using CPD bridges
作者
关键词
Carbon nanotube (CNT), Carbonized polymer dot (CPD), Copper matrix composites, Strengthening mechanism, Electrical conductivity
出版商
Elsevier BV
发表日期
2022-04-28
DOI
10.1016/j.msea.2022.143222

向作者/读者发起求助以获取更多资源

Reprint

联系作者

Find Funding. Review Successful Grants.

Explore over 25,000 new funding opportunities and over 6,000,000 successful grants.

Explore

Find the ideal target journal for your manuscript

Explore over 38,000 international journals covering a vast array of academic fields.

Search