A dual heterogeneous laminated microstructure design for improving the mechanical properties and electrical conductivity of copper alloys
出版年份 2022 全文链接
标题
A dual heterogeneous laminated microstructure design for improving the mechanical properties and electrical conductivity of copper alloys
作者
关键词
Dual heterogeneous structure, Accumulative roll bonding, Laminated composite, Hetero-deformation-induced hardening
出版物
MATERIALS CHARACTERIZATION
Volume 187, Issue -, Pages 111878
出版商
Elsevier BV
发表日期
2022-03-30
DOI
10.1016/j.matchar.2022.111878
参考文献
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