标题
Application of surface tension in the design of novel Sn-Ag-Cu-based solders
作者
关键词
Model prediction, Surface tension, SAC-based alloys, Pb-free solders
出版物
JOURNAL OF NON-CRYSTALLINE SOLIDS
Volume 582, Issue -, Pages 121444
出版商
Elsevier BV
发表日期
2022-02-09
DOI
10.1016/j.jnoncrysol.2022.121444
参考文献
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