A feasible ultrafine grained Cu matrix composite microstructure for achieving high strength and high electrical conductivity

出版年份 2016 全文链接

标题

作者

关键词

出版物

Volume 682, Issue -, Pages 590-593

出版商

Elsevier BV

发表日期

2016-05-08

DOI

10.1016/j.jallcom.2016.04.321

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