Dominant effect of high anisotropy in β-Sn grain on electromigration-induced failure mechanism in Sn-3.0Ag-0.5Cu interconnect

出版年份 2016 全文链接

标题

作者

关键词

Anisotropy, Intermetallics, Diffusion, Grain boundaries, Microstructure, Scanning electron microscopy

出版物

Volume 678, Issue -, Pages 370-374

出版商

Elsevier BV

发表日期

2016-04-05

DOI

10.1016/j.jallcom.2016.04.024

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