Highly reliable anisotropic interconnection system fabricated using Cu/Sn-Soldered microdumbbell arrays and polyimide films for application to flexible electronics

To fabricate high-performance flexible electronics, high-density electronic components should be safely integrated into limited areas, even under device deformation. However, simultaneously achieving device flexibility and strong bonds is challenging. Therefore, we fabricated Cu-Sn microdumbbell arrays on perforated polyimide (PI) substrates to develop a flexible interconnection system simultaneously exhibiting strong bonds and device flexibility by combining flexible PI films and metal-metal soldering. Cu microdumbbell arrays were formed by electroplating Cu on similar to 5-mu m-diameter micmholes that were randomly distributed on flexible PI film surfaces and subsequently covering the dumbbell head surface with Sn by electmless plating. The Sn-covered dumbbell heads acted as metallic solder, enabling strong bonds with electronic components through hot pressing by forming nanolayered Cu/Sn intermetallic compounds. Electronic chips bonded by the Cu-Sn microdumbbell arrays exhibited excellent shear bonding strength, even after 10,000 bending cycles. Finite element simulations revealed that crack propagation was hindered by the space between the micmdumbbells, thus enhancing the adhesion strength of the flexible interconnection system.

Automated summary

In this study, a flexible interconnection system with both strong bonds and device flexibility was developed by fabricating Cu-Sn microdumbbell arrays on perforated polyimide (PI) substrates. The Sn-covered microdumbbell heads acted as metallic solder, forming nanolayered Cu/Sn intermetallic compounds to achieve strong bonds with electronic components. The electronic chips bonded by the Cu-Sn microdumbbell arrays exhibited excellent shear bonding strength, even after 10,000 bending cycles.